Process characteristics of energy storage PCBA?

November 02, 2024

With the continuous growth of new energy demand and the transformation of energy structure, the market size of energy storage technology is constantly expanding. The energy storage PCB, as an important component of the battery module in the energy storage system, plays a critical role in the safety and performance of the entire system. Today we will talk about the characteristics of energy storage PCBs.

1. It is difficult to find BGA chips and some devices with fine spacing on energy storage PCB boards, mainly due to charging and discharging.

2. Energy storage boards generally have thicker copper, with most copper thicknesses above 2oz; And it is mainly characterized by high current, accompanied by high voltage (up to kilovolts).

3. Similarly, due to the high current operation, the board is more prone to heat generation, so energy storage PCB boards will undergo heat dissipation treatment, such as drilling heat dissipation holes or adding some encapsulated heat dissipation shells.

In addition, energy storage PCBs also have the following process characteristics:

1. Highly integrated:

Energy storage PCBA achieves high-density integration of components through high-precision manufacturing processes and advanced surface mount technology, making electronic products more powerful while reducing their size. This high-density integration benefits from the fine circuit design and advanced surface mount technology on the PCB, which allows the spacing between components to be reduced to the millimeter or even micrometer level.

2. Welding process

Welding is a critical step in the production process of energy storage PCBA. Adopting appropriate welding techniques can ensure the quality and reliability of solder joints. For energy storage PCBA, commonly used soldering techniques include surface mount technology (SMT) and wave soldering technology. These technologies can ensure a strong and reliable connection between components and substrates, and can operate normally under various working conditions.

3. Environmental friendliness

In the manufacturing process, energy storage PCBA pays attention to environmental protection, using environmentally friendly technologies such as lead-free solder and halogen-free solder mask materials, and recycling waste electronic products to reduce their impact on the environment.

4. Detail handling

During the manufacturing process, special attention should be paid to detail handling. For example, during component welding, it is necessary to strictly control the welding time and temperature to prevent quality problems caused by overheating or poor welding. In addition, during the installation of components, it is also necessary to pay attention to the correct orientation, position, and spacing of the components. Only by ensuring these details can the energy storage PCBA have good performance and reliability.

5. Quality control

To ensure the quality of energy storage PCBA, quality control is indispensable. During the production process, strict quality inspections are required, including visual inspection, functional testing, reliability testing, etc. Only by passing these tests can the reliability and stability of PCBA be guaranteed in practical applications.

So what should be paid attention to in the design and manufacturing of energy storage PCBs?

1. Choose high-performance materials suitable for high current applications as much as possible, such as FR-4, metal substrates, and composite materials, which have low resistance, high thermal conductivity, and good mechanical strength, and can withstand the heat and current concentration effects under high currents.

2. Balanced current distribution, reasonable current distribution can reduce the resistance and hotspot generation of the current path, such as adding balanced current devices, balanced resistors or current balancing layers, can improve the reliability and stability of the circuit board.

3. When routing PCB, try not to cross the high current path with digital signals to avoid mutual interference.

4. For high current paths, solid copper should be used as much as possible. Firstly, the current carrying capacity is relatively large. Secondly, it will have a good heat dissipation effect. Thirdly, it is necessary to avoid high impedance and large voltage drops on the wiring.

5. The heat generated by high current can damage devices and products, so the power path needs to be taken into account. Generally, a large area of copper is laid, holes are drilled, and the external impedance solder layer is excavated to expose the copper skin and accelerate heat dissipation.

6. When laying out, consideration should be given to the issue of high current EMC radiation, which can be achieved by designing with thicker line widths, larger aperture sizes, and increased spacing. Try to keep the high current path as short as possible and plan the path away from devices that are susceptible to interference (signal interference and thermal effects).

In summary, energy storage PCBA, as a key electronic component, has important applications in the field of energy storage. In the manufacturing process, environmental requirements, material selection, welding processes, detail processing, and quality control must be considered. Only through reasonable process characteristics and strict quality control can the performance and reliability of energy storage PCBA circuit boards be guaranteed, meeting the needs of various extreme environments.

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Author:

Mr. jinglin

Correo electrónico:

kingsleyliu@wisdommobi.com

Phone/WhatsApp:

+86 13537260078

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Author:

Mr. jinglin

Correo electrónico:

kingsleyliu@wisdommobi.com

Phone/WhatsApp:

+86 13537260078

productos populares

Noticias

¿Cuáles son los pasos en el ensamblaje PCB y PCBA？

October 17, 2024

Cómo seleccionar los materiales PCB correctos？

October 10, 2024

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Dongguan Jingling Communication Technology Co., Ltd. se centra en SMT, ensamblaje de PCBA y servicios de procesamiento y fabricación de OEM & ODM para varios productos electrónicos. Los equipos y la tecnología de producción existentes han alcanzado el nivel avanzado de pares nacionales y extranjeros, principalmente, incluyendo máquinas de impresión totalmente automáticas American DeK, máquinas SMT de alta velocidad de la serie Siemens D, hornos de soldadura de reflujo de trece zona de temperatura, etc. Los componentes SMD para 0201 y 01005, así como BGA y otros SMD de precisión ultra altura con un paso de pie de 0.3 mm, se pueden instalar. Al mismo tiempo, tiene equipos de soporte relacionados como AOI, rayos X, medidor de espesor de pasta de soldadura 3D, divisor de enrutamiento visual, divisor de corte en V, etc. tiene una fuerte capacidad integral de procesamiento y producción de soporte. Para mejorar la competitividad central de la compañía, el Centro de I + D y Marketing de Shenzhen se estableció en octubre de 2015, el principal responsable de la I + D front-end y la comercialización de los tableros de PCBA. Hay 12 ingenieros de I + D y 20 profesionales relacionados....

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